Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13078324
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Filing Dt:
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04/01/2011
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Publication #:
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Pub Dt:
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01/19/2012
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Inventors:
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Bertrand LEVERRIER, Dominique LEDUC
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Title:
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PACKAGE FOR VACUUM ENCAPSULATION OF AN ASSOCIATED MICROELECTROMECHANICAL SYSTEM, AND A METHOD FOR DETECTING A PROBLEM WITH A SOLDER JOINT IN SUCH AN ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 45, RUE DE VILLIERS |
| NEUILLY SUR SEINE, FRANCE 92200 |
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| STROOCK & STROOCK & LAVAN LLP |
| 180 MAIDENT LANE |
| FLOOR 38 |
| NEW YORK, NY 10038 |
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