Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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13241472
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Filing Dt:
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09/23/2011
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Publication #:
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Pub Dt:
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01/19/2012
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Inventors:
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Woong Sun LEE, Qwan Ho CHUNG
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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