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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/21/2013
Application #:
12708943
Filing Dt:
02/19/2010
Publication #:
Pub Dt:
01/13/2011
Inventors:
Junjie LI, Wenbin WANG, Qiuhong ZOU, Wei WANG, Guoqing YU
Title:
WAFER-LEVEL PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
023964/0302Recorded: 02/19/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2010
Exec Dt:
01/28/2010
Exec Dt:
01/28/2010
Exec Dt:
01/28/2010
Exec Dt:
01/28/2010
Assignee:
11B/C, SUCHUN INDUSTRIAL SQUARE, 428 XINGLONG STREET, SUZHOU INDUSTRIAL PARK,
JIANG SU PROVINCE, CHINA 215126
Correspondent:
CANTOR COLBURN, LLP
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103

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