Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/2013
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Application #:
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12771067
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Filing Dt:
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04/30/2010
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Publication #:
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Pub Dt:
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11/25/2010
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Inventors:
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Takuya Takahashi, Fumihiro Fuchino, Yuuichi Kohno, Masanori Miyata
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Title:
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Method Of Manufacturing Semiconductor Device Including Wiring Layout And Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, NAKAMAGOME 1-CHOME, OHTA-KU |
| TOKYO, 143-8555, JAPAN |
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| PAUL TENG |
| COOPER & DUNHAM LLP |
| 30 ROCKEFELLER PLAZA, 20TH FLOOR |
| NEW YORK, NEW YORK 10112 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-1, HIMEMURO-CHO, IKEDA-CITY |
| OSAKA, JAPAN 563-8501 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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