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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/11/2005
Application #:
11305036
Filing Dt:
12/19/2005
Publication #:
Pub Dt:
07/12/2007
Inventor:
Yicheng Li
Title:
Method and system for sealing a first assembly to a second assembly of a processing system
Assignment: 1
Reel/Frame:
017750/0553Recorded: 04/03/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/03/2006
Assignee:
3-6, AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-8481
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314

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