Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/04/2013
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Application #:
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12722483
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Filing Dt:
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03/11/2010
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Publication #:
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Pub Dt:
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09/30/2010
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Inventors:
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Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Te-Sheng Liu, Ping-Jung Yang
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Title:
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INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND BOTTOM STRUCTURE TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F.-1, NO. 29, PUDING ROAD |
| EAST DISTRICT |
| HSIN-CHU, TAIWAN 30072 |
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| DENNIS A. DUCHENE |
| 11682 EL CAMINO REAL |
| SUITE 400 |
| SAN DIEGO, CA 92130 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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