Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/11/2013
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Application #:
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13414236
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Filing Dt:
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03/07/2012
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Inventors:
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Shingo FUKASAWA, Tatsuyuki Okubo, Yoshihiro Kurihara
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Title:
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Die Bonder and Bonding Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6, MENUMA-NISHI 1-CHOME |
KUMAGAYA-SHI, SAITAMA, JAPAN |
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CROWELL & MORING LLP |
P.O. BOX 14300 |
WASHINGTON, DC 20044-4300 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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610-5 SHIMOIMASUWA |
MINAMI-ALPS CITY, YAMANASHI, JAPAN 400-0212 |
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CROWELL & MORING LLP |
P.O. BOX 14300 |
WASHINGTON, DC 20044-4300 |
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