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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/18/2013
Application #:
12321002
Filing Dt:
01/14/2009
Publication #:
Pub Dt:
05/20/2010
Inventor:
Sheng-Huang Lin
Title:
Heat radiating fin assembly and thermal module formed therefrom
Assignment: 1
Reel/Frame:
022178/0858Recorded: 01/14/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2008
Assignee:
7F.-3, NO. 24, WUCYUAN 2ND RD.
SINJHUANG CITY, TAIPEI COUNTY 242, TAIWAN R.O.C.
Correspondent:
JAMES J. PAIGE, ESQ.
NIKOLAI & MERSEREAU, P.A.
900 SECOND AVENUE SOUTH, #820
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
030064/0820Recorded: 03/22/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/20/2013
Assignee:
A3A01, 4TH FL., WANGJING SCIENCE AND TECHNOLOGY DEVELOPMENT BUILDING, THREE DISTRICT, WANGJING NEW INDUSTRY DISTRICT
CHAOYANG DISTRICT, BEIJING CITY, CHINA
Correspondent:
BEIJING AVC TECHNOLOGY RESEARCH CENTER
7FL., NO. 283, SEC. 2, FUSHING S. ROAD
TAIPEI CITY, 106 TAIWAN

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