Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/18/2013
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Application #:
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13146666
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Filing Dt:
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07/28/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Inventors:
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Toshiyuki Asahi, Yukihiro Shimasaki, Koji Shimoyama
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Title:
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THERMOCONDUCTIVE COMPOSITION, HEAT DISSIPATING PLATE, HEAT DISSIPATING SUBSTRATE AND CIRCUIT MODULE USING THERMOCONDUCTIVE COMPOSITION, AND PROCESS FOR PRODUCTION OF THERMOCONDUCTIVE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| PANASONIC PATENT CENTER |
| 1130 CONNECTICUT AVE., N.W., SUITE 1100 |
| WASHINGTON, DC 20036 |
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