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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/18/2013
Application #:
12867922
Filing Dt:
08/17/2010
Publication #:
Pub Dt:
12/16/2010
Inventors:
Tohru Ishizuka, Nobuhiko Noto, Norihiro Kobayashi, Masatake Nakano
Title:
SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI WAFER
Assignment: 1
Reel/Frame:
024849/0912Recorded: 08/17/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/09/2010
Exec Dt:
07/09/2010
Exec Dt:
07/09/2010
Exec Dt:
07/08/2010
Assignee:
6-2, OHTEMACHI 2-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
WILLIAM P. BERRIDGE
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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