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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
8470155
Issue Dt:
06/25/2013
Application #:
11921154
Filing Dt:
07/31/2009
Publication #:
20100066273
Pub Dt:
03/18/2010
Inventors:
Kenji Saito, Tamao Higuchi, Tokumi Ikeda
Title:
COPPER/NIOBIUM COMPOSITE PIPING MATERIAL PRODUCED BY COPPER ELECTROFORMING, PROCESS FOR PRODUCING THE SAME AND SUPERCONDUCTING ACCELERATION CAVITY PRODUCED FROM THE COMPOSITE PIPING MATERIAL
Assignment: 1
Reel/Frame:
020588/0829Recorded: 02/26/2008Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SAITO, KENJI
Exec Dt:
05/29/2006
IKEDA, TOKUMI
Exec Dt:
05/29/2006
HIGUCHI, TAMAO
Exec Dt:
05/19/2006
Assignees:
HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION
1-1, OHO, TSUKUBA-SHI
IBARAKI, 305-0801, JAPAN
NOMURA PLATING CO., LTD.
12-20, HIMEJIMA 5-CHOME, NISHIYODOGAWA-KU
OSAKA-SHI, OSAKA 555-0033, JAPAN
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: WARREN M. CHEEK, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, DC 20006-1021
Assignment: 2
Reel/Frame:
020952/0652Recorded: 05/07/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HIGUCHI, TAMAO
Exec Dt:
07/25/2006
Assignees:
HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION
1-1, OHO, TSUKUBA-SHI
IBARAKI 305-0801, JAPAN
NOMURA PLATING CO., LTD.
12-20, HIMEJIMA 5-CHOME, NISHIYODOGAWA-KU
OSAKA-SHI, OSAKA 555-0033, JAPAN
Correspondent:
WENDEROTH LIND & PONACK LLP
ATTN: WARREN M. CHEEK, ESQ.
2033 K STREET, NW
SUITE 800
WASHINGTON, DC 20006-1021
Assignment: 3
Reel/Frame:
020952/0336Recorded: 05/07/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SAITO, KENJI
Exec Dt:
04/08/2008
IKEDA, TOKUMI
Exec Dt:
04/02/2008
Assignees:
HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION
1-1, OHO, TSUKUBA-SHI
IBARAKI, JAPAN 305-0801
NOMURA PLATING CO., LTD.
12-20, HIMEJIMA 5-CHOME, NISHIYODOGAWA-KU, OSAKA-SHI
OSAKA, JAPAN 555-0033
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: WARREN M. CHEEK, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, DC 20006-1021

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