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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/02/2013
Application #:
11987617
Filing Dt:
12/03/2007
Publication #:
Pub Dt:
06/26/2008
Inventors:
Kentaro Kaneko, Kotaro Kodani, Junichi Nakamura, Kazuhiro Kobayashi
Title:
Wiring substrate and method for manufacturing the same
Assignment: 1
Reel/Frame:
020247/0307Recorded: 12/03/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/26/2007
Exec Dt:
11/26/2007
Exec Dt:
11/26/2007
Exec Dt:
11/26/2007
Assignee:
80, OSHIMADA-MACHI, NAGANO-SHI
NAGANO 381-2287, JAPAN
Correspondent:
DRINKER BIDDLE & REATH (DC)
1500 K STREET, N.W.
SUITE 1100
WASHINGTON, DC 20005-1209

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