Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/09/2013
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Application #:
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12213754
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Filing Dt:
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06/24/2008
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Publication #:
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Pub Dt:
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12/24/2009
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Inventors:
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Fong Lim, See Yau Lee, Yang Hong Heng
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE |
| VILLACH, AUSTRIA 9500 |
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| JACOBSON HOLMAN PLLC |
| 400 SEVENTH STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20004-2218 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| STEVEN E. DICKE |
| 100 SOUTH 5TH STREET |
| SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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