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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8486803
Issue Dt:
07/16/2013
Application #:
13273168
Filing Dt:
10/13/2011
Publication #:
20130095612
Pub Dt:
04/18/2013
Inventors:
Ping Huang, Ruisheng Wu, Lei Duan, Yi Chen, Yuping Gong
Title:
WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE OF A SEMICONDUCTOR CHIP
Assignment: 1
Reel/Frame:
027059/0223Recorded: 10/13/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, PING
Exec Dt:
10/09/2011
WU, RUISHENG
Exec Dt:
10/09/2011
DUAN, LEI
Exec Dt:
10/09/2011
CHEN, YI
Exec Dt:
10/09/2011
GONG, YUPING
Exec Dt:
10/09/2011
Assignee:
ALPHA AND OMEGA SEMICONDUCTOR, INCORPORATED
475 OAKMEAD PKWY
SUNNYVALE, CALIFORNIA 94085
Correspondent:
CHEIN-HWA S. TSAO
6684 MT PAKRON DRIVE
SAN JOSE, CA 95120

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