Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12345942
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Filing Dt:
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12/30/2008
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Publication #:
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Pub Dt:
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08/06/2009
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Inventors:
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Takayuki Kobayashi, Tsutomu Sasaki, Masamoto Tanaka, Katsuichi Kimura
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Title:
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SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-1, SOTOKANDA, CHIYODA-KU |
| TOKYO, JAPAN |
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| 158-1, SAYAMAGAHARA |
| IRUMA-SHI, JAPAN 358-0032 |
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| DARBY & DARBY, P.C. |
| 7 WORLD TRADE CENTER, 250 GREENWICH ST |
| NEW YORK, NY 10007 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET |
| WASHINGTON, DC 20001 |
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