Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12825617
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Filing Dt:
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06/29/2010
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Publication #:
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Pub Dt:
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12/29/2011
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Inventors:
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Chih-Chin Liao, Cheeman Yu
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Title:
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CORRUGATED DIE EDGE FOR STACKED DIE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 601 MCCARTHY BOULEVARD |
| MILPITAS, CALIFORNIA 95035 |
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| VIERRA MAGEN MARCUS & DENIRO LLP |
| 575 MARKET STREET |
| SUITE 2500 |
| SAN FRANCISCO, CA 94105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6900 NORTH DALLAS PARKWAY |
| TWO LEGACY TOWN CENTER |
| PLANO, TEXAS 75024 |
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| SANDISK CORPORATION |
| 601 MCCARTHY BOULEVARD |
| PATENT DEPARTMENT/SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6900 DALLAS PARKWAY |
| SUITE 325 |
| PLANO, TEXAS 75024 |
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| SANDISK |
| 951 SANDISK DRIVE |
| PATENT DEPARTMENT/SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 251 LITTLE FALLS DRIVE |
| WILMINGTON, DELAWARE 19808 |
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| WODEN TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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