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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/13/2013
Application #:
13371323
Filing Dt:
02/10/2012
Publication #:
Pub Dt:
08/02/2012
Inventors:
Masao SAKUMA, Kanji OTSUKA
Title:
CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME
Assignment: 1
Reel/Frame:
028038/0632Recorded: 04/12/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/19/2012
Exec Dt:
03/17/2012
Assignee:
NKF BLDG. 4TH FLOOR, 1-2 HIGASIDA-CHO, KAWASAKIKU, KANAGAWA
KAWASAKI-SHI, JAPAN 2100005
Correspondent:
SILICON VALLEY PATENT GROUP LLP
4010 MOORPARK AVENUE
SUITE 210
SAN JOSE, CA 95117
Assignment: 2
Reel/Frame:
029522/0886Recorded: 12/21/2012Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/04/2012
Assignee:
13-11 OMORI-KITA 2-CHOME, OTA-KU
TOKYO, JAPAN 1438580
Correspondent:
SILICON VALLEY PATENT GROUP LLP
4010 MOORPARK AVENUE
SUITE 210
SAN JOSE, CA 95117

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