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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8517605
Issue Dt:
08/27/2013
Application #:
12924091
Filing Dt:
09/20/2010
Publication #:
20110110396
Pub Dt:
05/12/2011
Inventors:
Matthew A. Grayson, Seda Memik, Andrea Grace Klock, Jieyi Long, Chuanle Zhou
Title:
BIMETALLIC INTEGRATED ON-CHIP THERMOCOUPLE ARRAY
Assignment: 1
Reel/Frame:
030345/0392Recorded: 05/03/2013Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GRAYSON, MATTHEW A.
Exec Dt:
12/28/2010
MEMIK, SEDA
Exec Dt:
01/04/2011
LONG, JIEYI
Exec Dt:
01/05/2011
ZHOU, CHUANLE
Exec Dt:
12/28/2010
KLOCK, ANDREA GRACE
Exec Dt:
12/17/2010
Assignee:
NORTHWESTERN UNIVERSITY
633 CLARK STREET
EVANSTON, ILLINOIS 60208
Correspondent:
KRIEG DEVAULT LLP
ONE INDIANA SQUARE
SUITE 2800
INDIANAPOLIS, IN 46204
Assignment: 2
Reel/Frame:
030345/0543Recorded: 05/03/2013Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GRAYSON, MATTHEW A.
Exec Dt:
12/28/2010
MEMIK, SEDA
Exec Dt:
01/04/2011
LONG, JIEYI
Exec Dt:
01/05/2011
ZHOU, CHUANLE
Exec Dt:
12/28/2010
KLOCK, ANDREA GRACE
Exec Dt:
12/17/2010
Assignee:
NORTHWESTERN UNIVERSITY
633 CLARK STREET
EVANSTON, ILLINOIS 60208
Correspondent:
KRIEG DEVAULT LLP
ONE INDIANA SQUARE
SUITE 2800
INDIANAPOLIS, IN 46204

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