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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8519537
Issue Dt:
08/27/2013
Application #:
12813212
Filing Dt:
06/10/2010
Publication #:
20110210444
Pub Dt:
09/01/2011
Inventors:
Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Chen-Hua Yu, Cheng-Chieh Hsieh et al
Title:
3D SEMICONDUCTOR PACKAGE INTERPOSER WITH DIE CAVITY
Assignment: 1
Reel/Frame:
024518/0354Recorded: 06/10/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JENG, SHIN-PUU
Exec Dt:
04/26/2010
CHEN, KIM HONG
Exec Dt:
04/29/2010
HOU, SHANG-YUN
Exec Dt:
04/26/2010
SHIH, CHAO-WEN
Exec Dt:
04/26/2010
HSIEH, CHENG-CHIEH
Exec Dt:
04/28/2010
YU, CHEN-HUA
Exec Dt:
04/28/2010
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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