Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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13272289
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Filing Dt:
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10/13/2011
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Publication #:
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Pub Dt:
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04/18/2013
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Inventors:
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Hui-Min WU, Ming-I Wang, Kuan-Yu Wang, Chien-Hsin Huang, Kun-Che Hsieh
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Title:
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BOND PAD STRUCTURE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 1940 DUKE STREET, SUITE 200 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BRACKEN ROAD, SANDYFORD |
| FIRST FLOOR, BLACKTHORN EXCHANGE |
| DUBLIN, IRELAND D18 P3Y9 |
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| LONGITUDE LICENSING LTD |
| BRACKEN ROAD, SANDYFORD |
| FIRST FLOOR, BLACKTHORN EXCHANGE |
| DUBLIN, D18 P3Y9 IRELAND |
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