Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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11987260
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Filing Dt:
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11/28/2007
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Publication #:
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Pub Dt:
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09/04/2008
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Inventor:
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Takaaki Morita
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Title:
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COLLECTIVE MOUNTING METHOD OF ELECTRONIC COMPONENTS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT -EMBEDDED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-13-1, NIHONBASHI |
| CHUO-KU, TOKYO, JAPAN 103-8272 |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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| 3-9-1, SHIBAURA, MINATO-KU |
| TOKYO 108-0023, JAPAN |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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