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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/01/2013
Application #:
12947390
Filing Dt:
11/16/2010
Publication #:
Pub Dt:
02/09/2012
Inventors:
Shin-Hua CHAO, Chao-Yuan LIU, Hui-Ying HSIEH, Chih-Ming CHUNG
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
025379/0007Recorded: 11/16/2010Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/02/2010
Exec Dt:
11/02/2010
Exec Dt:
11/02/2010
Exec Dt:
11/02/2010
Assignee:
NO.26, JINGSAN RD., NANTZ CHIU,
KAOHSIUNG, TAIWAN 811
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PLLC
4000 LEGATO ROAD
SUITE 310
FAIRFAX, VA 22033

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