Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13302501
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Filing Dt:
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11/22/2011
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Inventors:
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Jin Young Kim, Doo Hyun Park, Seung Jae Lee
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Title:
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WAFER LEVEL FAN OUT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85286-6604 |
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| MCKAY AND HODGSON, LLP |
| 1900 GARDEN ROAD, SUITE 220 |
| MONTEREY, CA 93940 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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| 901 MAIN STREET, 11TH FLOOR |
| DALLAS, TEXAS 75202 |
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| STEPHEN P. DEMM - HUNTON & WILLIAMS LLP |
| 951 EAST BYRD STREET |
| RIVERFRONT PLAZA - EAST TOWER |
| RICHMOND, VA 23219-4074 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 SOUTH HOPE STREET |
| 19TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| MCGUIREWOODS LLP |
| 1750 TYSONS BOULEVARD |
| SUITE 1800 |
| TYSONS, VA 22102 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLEY ROAD |
| #15-02/04 |
| VALLEY POINT, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| 34TH FLOOR |
| CHICAGO, IL 60661 |
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