Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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12947530
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Filing Dt:
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11/16/2010
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Publication #:
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Pub Dt:
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05/17/2012
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Inventors:
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Chung Foong Tan, Eng Huat Toh, Jae Gon Lee, Chunshan Yin, Lakshmi Bera
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Title:
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INTEGRATED CIRCUIT SYSTEM WITH BANDGAP MATERIAL AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D |
| STREET 2 |
| SINGAPORE 738406, SINGAPORE |
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| MIKIO ISHIMARU |
| LAW OFFICES OF MIKIO ISHIMARU |
| 333 W. EL CAMINO REAL, SUITE # 330 |
| SUNNYVALE, CA 94087 |
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Assignment:
2
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| 1100 NORTH MARKET STREET |
| WILMINGTON, DELAWARE 19801 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| BENJAMIN PETERSEN |
| 1460 EL CAMINO REAL, 2ND FLOOR |
| SHEARMAN & STERLING LLP |
| MENLO PARK, CA 94025 |
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