Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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12588659
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Filing Dt:
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10/22/2009
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Publication #:
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Pub Dt:
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04/28/2011
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Inventors:
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Yoshitaka Sasaki, Hiroyuki Ito, Atsushi Iijima
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Title:
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Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| SAE TECHNOLOGY CENTRE |
| 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, N.T., HONG KONG, CHINA |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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