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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8580690
Issue Dt:
11/12/2013
Application #:
13080676
Filing Dt:
04/06/2011
Publication #:
20120258596
Pub Dt:
10/11/2012
Inventors:
BRETT BUSCH, GOWRI DAMARLA, ANURAG JINDAL, CHIA-YEN HO, THY TRAN
Title:
PROCESS OF PLANARIZING A WAFER WITH A LARGE STEP HEIGHT AND/OR SURFACE AREA FEATURES
Assignment: 1
Reel/Frame:
026080/0053Recorded: 04/06/2011Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BUSCH, BRETT
Exec Dt:
03/02/2011
DAMARLA, GOWRI
Exec Dt:
03/02/2011
JINDAL, ANURAG
Exec Dt:
03/02/2011
HO, CHIA-YEN
Exec Dt:
03/31/2011
TRAN, THY
Exec Dt:
03/14/2011
Assignee:
NANYA TECHNOLOGY CORP.
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN
TAO-YUAN HSIEN, TAIWAN
Correspondent:
WINSTON HSU
P.O.BOX 506
MERRIFIELD, VA 22116

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