Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/19/2013
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Application #:
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13230369
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Filing Dt:
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09/12/2011
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Publication #:
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Pub Dt:
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03/22/2012
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Inventors:
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Peter Lieu, W. Eric Boyd
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Title:
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METHOD FOR DEPACKAGING PREPACKAGED INTEGRATED CIRCUIT DIE AND A PRODUCT FROM THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3001 RED HILL AVE., B4-108 |
| COSTA MESA, CALIFORNIA 92626 |
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| SHERI ANDERSON |
| 3001 RED HILL AVE., B4-108 |
| COSTA MESA, CA 92626 |
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Assignment:
2
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| 150 PACIFIC AVENUE |
| SAN FRANCISCO, CALIFORNIA 94111 |
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| BENJAMIN GREENSPAN |
| 620 LAGUNA RD |
| MILL VALLEY, CA 94941 |
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