Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/19/2013
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Application #:
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12133376
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Filing Dt:
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06/05/2008
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Publication #:
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Pub Dt:
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12/11/2008
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Inventors:
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Hao LIU, Yi Sheng Anthony SUN, Ravi Kanth KOLAN, Chin Hock TOH
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Title:
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THROUGH SILICON VIA DIES AND PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 SERANGOON NORTH AVENUE 5 |
| SINGAPORE, SINGAPORE 554916 |
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| HORIZON IP PTE LTD |
| 7500A BEACH ROAD |
| #04-306/308 THE PLAZA |
| SINGAPORE 199591, SINGAPORE |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO ADD THE ANNEX A AND THE ANNEX B WHICH WAS INADVERTENTLY LEFTOUT IN THE ORIGINAL ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 037959 FRAME 0822. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE INCLUDE PATENT NUMBER 8816482 PREVIOUSLY RECORDED AT REEL: 039885 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, SINGAPORE |
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