Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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12942437
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Filing Dt:
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11/09/2010
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Publication #:
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Pub Dt:
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05/10/2012
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Inventors:
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Takukazu OTSUKA, Keiji OKUMURA, Brian LYNN ROWDEN
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Title:
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HIGH MELTING POINT SOLDERING LAYER ALLOYED BY TRANSIENT LIQUID PHASE AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21 SAIIN MIZOSAKI-CHO |
| UKYO-KU, KYOTO-SHI |
| KYOTO-FU, JAPAN |
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| 2404 NORTH UNIVERSITY AVENUE |
| LITTLE ROCK, ARKANSAS 72207 |
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| CANTOR COLBURN LLP |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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