Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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12517551
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Filing Dt:
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10/06/2009
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Publication #:
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Pub Dt:
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02/11/2010
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Inventors:
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Kenya Tachibana, Masahiro Wada, Kensuke Nakamura, Hitoshi Kawaguchi
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Title:
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SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 1400002 |
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| MASAYASU MORI |
| 918 PRINCE STREET |
| ALEXANDRIA, VA 22314 |
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