Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/03/2013
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Application #:
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13364166
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Filing Dt:
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02/01/2012
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Inventors:
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Rajen Chanchani, Christopher Nordquist, Roy H. Olsson, Tracy C. Peterson, Randy J. Shul et al
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Title:
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MEMS Packaging with Etching and Thinning of Lid Wafer to Form Lids and Expose Device Wafer Bond Pads
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 5800 |
| MS0161 |
| ALBUQUERQUE, NEW MEXICO 87185-0161 |
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| LOWELL CARSON |
| P.O. BOX 5800 |
| MS0161 |
| ALBUQUERQUE, NM 87185-0161 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1000 INDEPENDNCE AVE., SW |
| WASHINGTON, DISTRICT OF COLUMBIA 20585 |
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| BRENDA K. BANKS |
| 1000 INDEPENDENCE AVE. |
| WASHINGTON, DC 20585 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 5800 |
| MS-0161 |
| ALBUQUERQUE, NEW MEXICO 87185 |
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| SANDIA NATIONAL LABORATORIES |
| P.O. BOX 5800 |
| MS-0161 |
| ALBUQUERQUE, NM 87185 |
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