Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12150118
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Filing Dt:
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04/24/2008
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Publication #:
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Pub Dt:
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03/04/2010
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Inventor:
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Harpuneet Singh
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Title:
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SMALL FORM FACTOR MODULES USING WAFER LEVEL OPTICS WITH BOTTOM CAVITY AND FLIP-CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 305 INTERLOCKEN PARKWAY |
| BROOMFIELD, COLORADO 80021 |
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| LARRY E. HENNEMAN, JR. |
| 70 N. MAIN ST. |
| THREE RIVERS, MI 49093 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| LARRY E. HENNEMAN, JR. |
| 70 N. MAIN ST. |
| THREE RIVERS, MI 49093 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DINGXIANG ROAD EAST, ECONOMIC TECHNOLOGICAL |
| JIANGXI |
| NANCHANG, CHINA 33000 |
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| NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP |
| 1875 I ST NW |
| SUITE 1100 |
| WASHINGTON, DC 20006 |
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