Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/31/2013
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Application #:
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12926441
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Filing Dt:
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11/18/2010
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Publication #:
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Pub Dt:
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06/02/2011
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Inventors:
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Tetsuya Ohsawa, Hitoki Kanagawa
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Title:
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CONNECTION STRUCTURE OF ELECTRONIC COMPONENT AND WIRED CIRCUIT BOARD, WIRED CIRCUIT BOARD ASSEMBLY, AND METHOD FOR TESTING ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI |
| OSAKA, JAPAN 567-8680 |
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| JEAN C. EDWARDS, ESQ. |
| 8100 BOONE BOULEVARD |
| SUITE 700 |
| VIENNA, VA 22182 |
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