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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
01/28/2014
Application #:
13364804
Filing Dt:
02/02/2012
Publication #:
Pub Dt:
05/31/2012
Inventors:
Paul Stephen Andry, Edmund Juris Sprogis, Cornelia Kang-I Tsang
Title:
THROUGH SILICON VIA FOR USE IN INTEGRATED CIRCUIT CHIPS
Assignment: 1
Reel/Frame:
028792/0676Recorded: 08/15/2012Pages: 26
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306
Assignment: 2
Reel/Frame:
051446/0476Recorded: 12/30/2019Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2019
Assignee:
1 TERMINAL DRIVE
PLAINVIEW, NEW YORK 11803
Correspondent:
ALAN P KASS
394 ELIZABETH AVENUE
SOMERSET, NJ 08873
Assignment: 3
Reel/Frame:
051383/0768Recorded: 12/30/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/24/2019
Assignee:
1 TERMINAL DRIVE
PLAINVIEW, NEW YORK 11803
Correspondent:
ALAN P KASS
394 ELIZABETH AVENUE
SOMERSET, NJ 08873

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