Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/28/2014
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Application #:
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12903779
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Filing Dt:
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10/13/2010
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Publication #:
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Pub Dt:
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04/14/2011
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Inventors:
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Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Title:
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MODULAR LOW STRESS PACKAGE TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7875 EDGEWATER DRIVE |
| OAKLAND, CALIFORNIA 94621 |
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| STMICROELECTRONICS, INC. |
| MAIL STATION 2346 |
| 1310 ELECTRONICS DRIVE |
| CARROLLTON, TX 75006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1310 ELECTRONICS DRIVE |
| CARROLLTON, TEXAS 75006 |
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| STMICROELECTRONICS, INC. |
| MAIL STATION 2346 |
| 1310 ELECTRONICS DRIVE |
| CARROLLTON, TX 75006 |
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Assignment:
3
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| 380 INTERLOCKEN CRESCENT, SUITE 600 |
| BROOMFIELD, COLORADO 80021 |
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| BENJAMIN C. WILES |
| TROUTMAN SANDERS LLP |
| 600 PEACHTREE STREET NE, SUITE 5200 |
| ATLANTA, GA 30308 |
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