Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13205864
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Filing Dt:
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08/09/2011
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Publication #:
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Pub Dt:
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02/14/2013
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Inventors:
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Yan Xun Xue, Ping Huang, Yueh-Se Ho, Jun Lu, Hamza Yilmaz, Ming-Chen Lu
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Title:
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WAFER LEVEL PACKAGE STRUCTURE AND THE FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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475 OAKMEAD PKWY |
SUNNYVALE, CALIFORNIA 94085 |
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CHEIN-HWA S. TSAO |
6684 MT PAKRON DRIVE |
SAN JOSE, CA 95120 |
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