Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13607775
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Filing Dt:
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09/09/2012
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Inventors:
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Yuping Gong, Yan Xun Xue, Ping Huang
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Title:
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SEMICONDUCTOR WAFER LEVEL PACKAGE (WLP) AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ZEPHYR HOUSE, 122 MARRY STREET, P.O. BOX 709 |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1107 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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