Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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12729911
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Filing Dt:
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03/23/2010
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Publication #:
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Pub Dt:
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09/29/2011
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Inventors:
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Martin Liu, Richard Chu, Hung-Hua Lin, Hsin-Ting Huang, Yuan-Chih Hsieh, Chun-Wen Cheng et al
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Title:
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WAFER LEVEL PACKAGING BOND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE, LLP IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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