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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/11/2014
Application #:
12054082
Filing Dt:
03/24/2008
Publication #:
Pub Dt:
06/04/2009
Inventors:
Hsien-Wei Chen, Hao-Yi Tsai, Yu-Wen Liu, Shin-Puu Jeng
Title:
WAFER SCRIBE LINE STRUCTURE FOR IMPROVING IC RELIABILITY
Assignment: 1
Reel/Frame:
020693/0776Recorded: 03/24/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/11/2008
Exec Dt:
03/11/2008
Exec Dt:
03/11/2008
Exec Dt:
03/11/2008
Assignee:
NO. 8, LI-HSIN ROAD 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
STEVEN E. KOFFS, DUANE MORRIS LLP
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103-4196

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