Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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12733462
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Filing Dt:
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03/03/2010
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Publication #:
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Pub Dt:
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07/15/2010
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Inventors:
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Kazuo Ono, Masami Kaneko, Natsuki Amanokura
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Title:
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INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1, OHTEMACHI 2-CHOME |
CHIYODA-KU, TOKYO 1008165, JAPAN |
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JAMES A. OLIFF |
OLIFF & BERRIDGE, PLC |
P.O. BOX 320850 |
ALEXANDRIA, VA 22320-4850 |
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