Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/04/2014
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Application #:
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13112755
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Filing Dt:
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05/20/2011
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Publication #:
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Pub Dt:
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11/22/2012
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Inventors:
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Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Wen-De Wang et al
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Title:
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A BONDING PAD STRUCTURE FOR A BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| HAYNES AND BOONE, LLP IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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