Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/04/2014
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Application #:
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13247603
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Filing Dt:
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09/28/2011
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Publication #:
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Pub Dt:
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01/10/2013
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Inventors:
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Chang Hyun Lim, Young Ki Lee, Kwang Soo Kim, Seog Moon Choi
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Title:
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POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG YEONGTONG-GU |
| SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LADAS & PARRY |
| 5670 WILSHIRE BOULEVARD, SUITE 2100 |
| LOS ANGELES, CA 90036-5679 |
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