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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/18/2014
Application #:
11340739
Filing Dt:
01/27/2006
Publication #:
Pub Dt:
08/02/2007
Inventors:
Shizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga
Title:
Method for packing solid organometallic compound and packed container
Assignment: 1
Reel/Frame:
017650/0802Recorded: 03/17/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/13/2006
Exec Dt:
02/13/2006
Exec Dt:
02/13/2006
Assignee:
4555 BANCHI, KAISEI-CHO, YAMAGUCHI
SHUNAN-SHI, JAPAN
Correspondent:
WENDEROTH LIND & PONACK, L.L.P.
ATTN: MICHAEL R. DAVIS, ESQ.
2033 K STREET, N.W.
SUITE 800
WASHINGTON, DC 20006-1021

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