Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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11821051
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Filing Dt:
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06/20/2007
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Publication #:
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Pub Dt:
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12/25/2008
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Inventors:
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John Boyd, Fritz Redeker, Shijian Li, Yezdi Dordi, Hyungsuk Alexander Yoon
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Title:
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METHODS AND APPARATUSES FOR THREE DIMENSIONAL INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4650 CUSHING PARKWAY |
FREMONT, CALIFORNIA 94538 |
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LARRY WILLIAMS |
3645 MONTGOMERY DR. |
SANTA ROSA, CA 95405-5212 |
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