Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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13114188
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Filing Dt:
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05/24/2011
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Publication #:
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Pub Dt:
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12/01/2011
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Inventors:
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Kei MURAYAMA, Shigeaki Suganuma, Masakuni Kitajima, Ryuichi Matsuki, Hiroyuki Miyajima
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Title:
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HEAT RADIATION COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-SHI, |
| NAGANO, JAPAN 381-2287 |
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| IPUSA, P.L.L.C |
| 1054 31ST STREET, N.W. |
| SUITE 400 |
| WASHINGTON, DC 20007 |
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