Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2014
|
Application #:
|
11835814
|
Filing Dt:
|
08/08/2007
|
|
Publication #:
|
|
Pub Dt:
|
02/12/2009
| | | | |
|
Inventors:
|
Yuan-Chih Hsieh, Shih-Chang Liu, Shih-Chi Fu, Tzu-Hsuan Hsu, Chung-Yi Yu, Gwo-Yuh Shiau et al
|
|
Title:
|
EMBEDDED BONDING PAD FOR IMAGE SENSORS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
|
|
|
|
| DAVID M. O'DELL |
| HAYNES AND BOONE, LLP |
| 901 MAIN STREET, SUITE 3100 |
| DALLAS, TX 75202 |
|
|
Search Results as of:
05/06/2024 12:32 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
