Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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12625862
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Filing Dt:
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11/25/2009
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Publication #:
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Pub Dt:
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06/03/2010
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Inventors:
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Yasunori Karasawa, Isao Ichikawa
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Title:
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Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23-23, HONCHO, ITABASHI-KU |
TOKYO, JAPAN 173 0001 |
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THE WEBB LAW FIRM, P.C. |
700 KOPPERS BUILDING |
436 SEVENTH AVENUE |
PITTSBURGH, PA 15219 |
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