Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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13714200
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Filing Dt:
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12/13/2012
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Publication #:
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Pub Dt:
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07/11/2013
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Inventors:
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Young Woo LEE, Sung Jae HONG, Im Bok LEE, Jeong Tak MOON
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Title:
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TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 316-2 GEUMEO-RI, POGOK-EUP, CHEOIN-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 449-812 |
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| VOLPE AND KOENIG, P.C. |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED ON REEL 029474 FRAME 0275. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNEE'S ADDRESS FROM "DEMOCRATIC PEOPLE'S REPUBLIC OF KOREA" TO --REPUBLIC OF KOREA--.
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| 316-2 GEUMEO-RI, POGOK-EUP, |
| CHEOIN-GU, YONGIN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 449-812 |
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| YONG BEOM HWANG |
| VOLPE AND KOENIG, P.C. |
| 30 S. 17TH STREET, UNITED PLAZA |
| PHILADELPHIA, PA 19103 |
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