Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/13/2014
|
Application #:
|
11910050
|
Filing Dt:
|
06/15/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/18/2010
| | | | |
|
Inventors:
|
Mitsuyoshi Matsuda, Hisao Sakai, Makoto Dobashi, Sakiko Tomonaga
|
|
Title:
|
Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 1418584 |
|
|
|
|
| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
|
|
Search Results as of:
05/12/2024 05:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
