Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/13/2014
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Application #:
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14083492
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Filing Dt:
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11/19/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Inventors:
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Masaki KASAI, Osamu MIYATA
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Title:
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SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING DIFFERENT THERMAL EXPANSION COEFFICIENT AND ELASTICITY MODULUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 615-8585 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST. N.W. |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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